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Home Tech & Gadgets Honor Magic 7 Pro gets Snapdragon 8 Gen 4 SoC; more details leak

Honor Magic 7 Pro gets Snapdragon 8 Gen 4 SoC; more details leak

by Jeffrey Beilley
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Honor Magic 7 Pro is expected to launch soon as a successor to the Magic 6 Pro 5G that was recently unveiled in India. Details regarding the alleged smartphone have been surfacing online in the past few weeks with key features and the expected design of the handset having been leaked. Now, a report has suggested the full list of expected specifications of the Magic 7 Pro. The phone is said to come with Qualcomm’s Snapdragon 8 Gen 4 chipset and a 50-megapixel triple rear camera unit.

Honor Magic 7 Pro Specifications, Features (Expected)

According to a CNMO report, the Honor Magic 7 Pro is expected to feature a 6.82-inch 2K dual-layer OLED display with quad-curved edges, a 120Hz refresh rate, and Honor’s Eye Protection 3.0. report. The display could come with 8T LTPO technology and Kunlun Glass protection. It is said to be powered by the Snapdragon 8 Gen 4 chipset, paired with UFS 4.0 onboard storage and LPDDR5X RAM.

For optics, the Honor Magic 7 Pro is likely to get a triple camera system on the back, which could include a 50-megapixel OmniVision OV50H primary sensor and a 50-megapixel sensor paired with an ultra-wide-angle lens. The third camera on the rear could include either a 50-megapixel Sony IMX882 periscope telephoto shooter or a 200-megapixel Samsung ISOCELL HP3 sensor. Meanwhile, the front-facing camera on the handset is tipped to have a 50-megapixel sensor alongside a 3D depth sensor.

As per the report, the Honor Magic 7 Pro is expected to feature a 5,800mAh battery that is backed by third-generation Qinghai Lake battery technology. The smartphone may come with support for 100W wired and 66W wireless charging.

For security, the Honor Magic 7 Pro is tipped to come with an ultrasonic fingerprint sensor and a 2D facial recognition feature. The phone could come with an IP68 or IP69 rating for dust and splash resistance. It is expected to support satellite communications and could feature the C1+ RF chipset alongside an E1 efficiency chip, as well as a linear x-axis motor.

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