MediaTek Dimensity 7300 series chipsets were unveiled by the company on Thursday. The Taiwanese semiconductor giant introduced the Dimensity 7300 and Dimensity 7300X chipsets with advanced AI computing capabilities and a focus on multitasking. It is built on TSMC’s advanced third-generation 4nm process technology and offers up to 25 percent lower power consumption compared to the Dimensity 7050 SoC. Notably, the company said that the Dimensity 7300X is designed with flip-style foldable smartphones in mind and can support dual displays.
The new chipsets feature an octa-core CPU consisting of four Arm Cortex-A78 cores clocked at 2.5GHz and four Arm Cortex-A55 efficiency cores, according to MediaTek’s press release. The CPU is paired with Arm Mali-G615 GPU and MediaTek’s HyperEngine optimizations. The company says the combination is aimed at improving gaming experiences on smartphones.
Furthermore, these chipsets are also built with optimizations for resource usage, 5G connectivity, and Wi-Fi gaming connections. The Dimensity 7300 chipsets support Bluetooth LE audio technology and Dual-Link True Wireless Stereo (TWS) audio.
In terms of image processing, the chipsets also include the MediaTek Imagiq 950 ISP, which comes with a 12-bit HDR ISP and supports up to a 200-megapixel primary camera. The hardware engines also have Multi-Channel Noise Reduction (MCNR), HWFD (Hardware Face Detection), and video HDR capabilities. The company says that these improvements will allow users to capture brighter photos and videos in all lighting conditions.
Compared to its predecessor, the live focus photo performance feature is up to 1.3x faster, while photo remastering is up to 1.5x faster. The Dimensity 7300 chipsets also allow users to record 4K HDR videos, which have a dynamic range that is over 50 percent greater than competitors in the segment, claims MediaTek. This upgrade should bring out more details in videos.
For AI computing, the chipsets feature the MediaTek APU (Agent Processing Unit) 655 which is claimed to increase the efficiency of AI tasks. The APU can also handle mixed-precision data types. This is said to help in better utilization of memory bandwidth and reduce memory requirements for larger AI models. The company has not mentioned the parameter size that the APU can handle.
In terms of connectivity, the MediaTek Dimensity 7300 chipsets offer between 13 percent and 30 percent better power efficiency in 5G sub-6GHz connections. It supports up to 3.27 Gbps 5G downlink via 3CC carrier aggregation. This enables the chipset to deliver faster downlinks in urban and suburban areas. Further, the chipsets support dual 5G SIM along with dual VoNR (Voice over New Radio) and tri-band Wi-Fi 6E.
